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Electrode Package for Electric Field Micro Sensor |
WEN Xiaolong① REN Tianling① XIA Shanhong② |
①(Institute of Microelectronics, Tsinghua University, Beijing 100084, China)
②(State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China) |
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Abstract To improve the environmental adaptation of the package of electric field micro sensor, this article introducs a new electrode package. Different from placing the sensing chip and package inside the measured environment, a package electrode, which is the only part exposed outside, is invented. In this way, the package shell is effectively protected from various environmental extremes. Based on this structure, new atmospheric electric field micro sensors are introduced on the ground and for sounding. The FEM and experiments show that the new sensors measure electric field accurately and stably under high humidity and low temperature environment.
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Received: 08 June 2016
Published: 30 September 2016
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Fund: The National Natural Science Foundation of China (61302032, 61327810, 61201078) |
Corresponding Authors:
WEN Xiaolong
E-mail: wenguangguy@163.com
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