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| THE STUDY OF TITANIUM CONTENT IN TITANIUM-SILVERCOPPER ALLOY SOLDER AND SEALING TECHNOLOGY FOR CERAMIC-METAL SEAL |
| Pan Shuang Xiao Maohe Yin Wenxue |
| Institute of Electronics;Academia Sinica |
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Abstract For a long time Mo-Mn metallization with Ti-powder coating ceramicmetal sealing technologies have been used in the production of vacuum devices. But these technologies are quite complex and the sealing quality is hardly guaranteed. Some reseaches on the direct sealing technology using Ti-Ag-Cu active alloy solder are carried out, with the influence of the content of the active element Ti, the sealing temperature and other parameters on the seal quality suitably investigated. Suitable Ti content in the alloy solder and specifications for sealing are given . The experimental results prove that the direct sealing technology using Ti-Ag-cu alloy solder is not complex and seal quality is stable.
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Received: 09 August 1982
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1983, Vol. 5 
