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| Effect of Plated Helix on Heat Dissipation Capability of the Slow-Wave Circuit |
| Han Yong①②; Liu Yan-wen①; Ding Yao-gen①; Liu Pu-kun①; Lu Chun-hua①; Wang Xiao-yan① |
| ①Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China;②Graduate University of Chinese Academy of Sciences, Beijing 100039, China |
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Abstract The effect of plated helix on heat dissipation capability of the slow-wave circuit is studied in this paper. With the plated helix, the improvement of the heat dissipation capability of the slow-wave circuit is estimated and evaluated. ANSYS is used to simulate the thermal conduction in the components. The influence of helices coated with copper film, gold film, diamond film upon the heat dissipation is analyzed and verified with computer simulation. Finally, several experimental tests are performed in some slow-wave circuits with copper plated helix and gold plated helix. The tests show good agreement with the theoretical analysis.
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Received: 23 January 2007
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2008, Vol. 30 
