①(State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China) ②(University of Chinese Academy of Sciences, Beijing 100049, China)
Abstract：Cross-axis coupling interference influences greatly the measurement accuracy of Three-Dimensional (3D) Electric Field Sensor (EFS). A MEMS-based One-Dimensional (1D) Electric Field Microsensor (EFM) chip with low coupling interference is presented, and a MEMS-based 3D EFS with low cross-axis coupling
interference is developed by arranging three 1D EFM chips orthogonally. Different from previously reported 1D EFM chips sensitive to perpendicular electric field component, the proposed 1D EFM chip is designed to be symmetrical and connected to difference circuit, so that it is capable of sensing parallel electric field component perpendicular to axis of symmetry and eliminating coupling interference. The proposed 3D EFS has the advantages of small size and high integration. Experimental results reveal that in the range of 0～120 kV/m, the cross-axis sensitivities are within 3.48%, and the total measurement errors of this 3D EFS are within 7.13%.
