Chip-level Vacuum Package and Test of Resonant MEMS Electric Field Sensor
Wu Zheng-wei①② Peng Chun-rong① Yang Peng-fei③ Wen Xiao-long④ Li Bing①② Xia Shan-hong①
①(State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China) ②(University of Chinese Academy of Sciences, Beijing 100049, China) ③(Institute of Microelectronics, Peking University, Beijing 100871, China) ④(Institute of Microelectronics, Tsinghua University, Beijing 100084, China)
In order to improve the Q (Quality factor) value and SNR (Signal to Noise Ratio) and reduce the driving voltage, chip-level vacuum package of Micro-Electro-Mechanical Systems (MEMS) based resonant miniature electric field sensor is realized. By way of a novel fusion bonding process with nanogetter added, the package cap is successfully bonded with the base substrate in very low pressure. The experimental results show that the Q-value of the sensor increases 500 times to 30727.4 and the driving voltage reduces to 100 mV +60 mVp-p which decreases to 1/200 and 1/16 respectively compared to air pressure.
毋正伟,彭春荣,杨鹏飞,闻小龙,李冰,夏善红. 谐振式微型电场传感器芯片级真空封装及测试[J]. 电子与信息学报, 2015, 37(9): 2282-2286.
Wu Zheng-wei, Peng Chun-rong, Yang Peng-fei. Chip-level Vacuum Package and Test of Resonant MEMS Electric Field Sensor. JEIT, 2015, 37(9): 2282-2286.
Luo Fu-shan. The lightning protection system of Kennedy Space Center[J]. Missiles and Spacecraft, 1991(3): 43-46.
[2]
Luo Fu-shan. The principle of micro-rocket electric field instrument and its application[J]. Chinese Journal of Geophysics, 2000, 43(5): 616-620.
[3]
Patrick S R, Karen L S, Richard S, et al.. Electrostatic charge and field sensors based on micromechanical resonators[J]. Journal of Microelectromechanical Systems, 2003, 12(5): 577-589.
[4]
Wijeweera G, Bahreyni B, Shafai C, et al.. Micromachined electric-field sensor to measure AC and DC fields in power systems[J]. IEEE Transactions on Power Delivery, 2009, 24(3): 988-995.
[5]
Yang Peng-fei, Peng Chun-rong, Fang Dong-ming, et al.. Design, fabrication and application of an SOI-based resonant electric field microsensor with coplanar comb-shaped electrodes[J]. Journal of Mciromechanics and Microengineering, 2013, 23(5): 266-285.
[6]
Yang Peng-fei, Peng Chun-rong, Zhang Hai-yan, et al.. A high sensitivity SOI electric-field sensor with novel comb-shaped microelectrodes[C]. The 16th International Conference on Solid-State Sensors, Actuators and Microsystems, Beijing, China, 2011: 1034-1037.
[7]
Wen Xiao-long, Peng Chun-rong, Fang Dong-ming, et al.. High performance electric field micro sensor with combined differential structure[J]. Journal of Electronics (China), 2014, 31(2): 143-150.
[8]
Bahreyni B, Wijeweera G, Shafai C, et al.. Analysis and design of a micromachined electric-field sensor[J]. Journal of Microelectromechanical Systems, 2008, 17(1): 31-36.
Liu Xue-song, Yan Gui-zhen, Hao Yi-long, et al.. Investigation on Au-Si wafer bonding for MEMS device packaging[J]. Micronanoelectronic Technology, 2003(Suppl.): 238-240.
Zhang Dong-mei, Ding Gui-fu, Wang Hong, et al.. Low temperature hermetic bonding process based on electrodeposited Sn/Bi alloy[J]. Journal of Functional Materials and Devices, 2006, 11(3): 211-214.
[11]
Chiao Mu and Lin Li-wei. Device-level hermetic packaging of microresonators by RTP aluminum-to-nitride bonding[J]. Journal of Microelectromechanical Systems, 2006, 15(3): 515-522.
[12]
Sparks D R, Massoud-Ansari S, and Najafi N. Chip-level vacuum packaging of micromachines using NanoGetters[J]. IEEE Transactions on Advanced Packaging, 2003, 26(3): 277-282.
[13]
Du Xian-feng, Zhang Da-cheng, and Lee Ting. Chip level packaging for MEMS using silicon cap[C]. IEEE/CPMT/ SEMI 29th International Electronics Manufacturing Technology Symposium, San Jose, CA, USA, 2004: 342-344.
[14]
Cheng Pang, Zhan Zhao, Zhen Fang, et al.. Adhesive bonding with SU-8 in a vacuum for capacitive pressure sensors[J]. Sensors and Actuators A: Physical, 2008, 147(2): 672-676.
Peng Chun-rong, Gong Chao, Chen Xian-xiang, et al.. Electric field micro-sensor based on electrostatic comb-driven and differential detecting[J]. China Mechanical Engineering, 2005, 16(Suppl.): 171-173.
[16]
Tang W C, Nguyen T H, and Howe R T. Laterally driven polysilicon resonant microstructures[J]. Sensors & Actuators, 1989(20): 25-32.
Yang Peng-fei, Peng Chun-rong, Zhang Hai-yan, et al.. Design and testing of a SOI Electric-field Microsensor[J]. Journal of Electronics & Information Technology, 2011, 33(11): 2771-2774.
