Abstract:With the increasing of system frequency, the characteristics of microstrip substrates are non-ignorable factor for affecting the crosstalk between transmission lines. This paper analyzes the crosstalk between two parallel microstrip lines based on the transmission line equations and S parameters, simulates the crosstalk with different permittivity and thickness of the substrate with 3D full-wave electromagnetic tool. The electric field distributions of microstrips with different substrates and the results of near-end and far-end crosstalks with the changing of frequency, substrate permittivity and thickness are obtained. The far-end crosstalk will be greater than the near-end crosstalk with the frequency increasing, and moreover, with the increasing of substrate permittivity and thickness, the crosstalks of microstrips will present a sine upward trend.
白雪, 徐雷钧. 衬底材料对微带线间串扰耦合的影响研究[J]. 电子与信息学报, 2010, 32(11): 2768-2771.
Bai Xue, Xu Lei-Jun. Research on the Effects of Substrates on the Crosstalk in Microstrips. , 2010, 32(11): 2768-2771.