①Institute of Electronics, Chinese Academy of Science, Beijing 100080, China; ②Graduate University of Chinese Academy of Science, Beijing 100039, China
Abstract:In this article, the ANSYS modeling problem of PCB thermal reliability analysis is studied. By ANSYS analysis, two conclusions can be drawn: (1) Copper lead on PCB has significant thermal transmission effect, so it should not be omitted in modeling. (2) Component with little inner to exterior thermal resistance can be modeling as a simple block. Based on these conclusions, the ANSYS modeling of a satelliteborne PCB equipment is largely simplified. Compared the ANSYS calculation results with experiment datas, it is proved that the simplified modeling method achieves adequate precision and is very convenience to use. This technique can be adopted in the thermal reliability analysis of PCB equipments , especially for satelliteborne or vacuum environments.