Abstract：Available defect outline model used for yield prediction and inductive fault analysis of integrated circuits (IC) all model a real defect by replacing its real rugged outlines with circular discs or squares,then great errors were aroused in these models.Based on the idea of fractal interpolation,this paper presents a new model to characterize those real defect outlines.The comparison of the new model with those models available indicates that the new model is a more accurate defect outline model.
2000, Vol. 22 
